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全新一代FPGA云主机F3

高密度计算平台，极致加速性能

申请邀测帮助文档

F3邀测说明

测试阶段，近期首先开放3种规格实例：(ecs.f3-c16f1.4xlarge；ecs.f3-c16f1.8xlarge；ecs.f3-c16f1.16xlarge；)
每个客户（UID账号）仅限免费购买一台实例使用周期为7天。（仅实例部分免费，其他ECS资源：包括云盘、公网带宽、快照等正常计费）

F3产品特性

采用Xilinx最新16nm Virtex UltraScale+ 器件VU9P

最大实例支持16个VU9P芯片，邀测开放4个VU9P实例

邀测实例提供高达 47 TeraMACs 的DSP计算能力。

F3产品结构特性

在FPGA Shell架构上，F3在沿用前代技术基础上，充分支持OpenCL，HLS以及RTL的开发流程，能够让多种应用程序开发的工程师，在不需要关注底层硬件细节的情况下，很好地完成异构计算的定制开发工作。
在硬件上，采用了创新的单卡双芯片设计，卡内双芯片互联带宽高达600Gbps，卡间互联通过硬核实现，支持100G Mac协议。单片FPGA逻辑量250万，外挂4个DDR4通道，提供64GB存储能力。

典型场景：H.265视频编码

编码速度：对应x265的“very slow”配置结果，FPGA编码器能够达到1080p60（60帧/秒）的处理能力，远大于x265的3帧/秒

实例规格列表

实例规格
FPGA(VU9P)
vCPU
内存（GiB）
网络宽带（Gbit/s）
ecs.f3-c16f1.4xlarge
1
16
64
5
ecs.f3-c16f1.8xlarge
2
32
128
10
ecs.f3-c16f1.16xlarge
4
64
256
20

申请邀测

全新一代FPGA云主机F3

F3邀测说明

F3产品特性

F3产品结构特性

典型场景：H.265视频编码

实例规格列表

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95187转1

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